The capping ceremony of Xinzhuo Semiconductor's 6-inch RF chip capacity expansion project undertaken by our company was successfully held.

On November 28th, the capping ceremony of Xinzhuo Semiconductor's 6-inch RF chip capacity expansion project undertaken by our company was successfully held. Ye Shifen, general manager of Wuxi Xinzhuo Huguang Semiconductor Co., Ltd., and Liu Peng, deputy general manager of production in South China Region of CLP II, attended the ceremony.

The planned construction area of Xinzhuo Semiconductor's 6-inch RF chip capacity expansion project is 9769.6 square meters. After the project is completed, it will help to enhance the market competitiveness of 6-inch SAW filter and 12-inch IPD filter products of Xinzhuo Huguang Company, and inject new vitality into the development of Wuxi semiconductor industry.

Ye Shifen expressed sincere gratitude to CLP II for its contribution, and put forward requirements and expectations for the follow-up construction tasks, project quality and smooth delivery.

Liu Peng said that the company will continue to carry out the mission of central enterprises, make every effort to promote the follow-up construction of the project, strictly observe the safety bottom line, strictly control the project quality, strictly control the construction period, achieve the project construction goal with high standards, and strive to complete the project as soon as possible.

In the future, CLP II will continue to complete the follow-up construction tasks of the project with an attitude of Excellence, give back the trust and expectation of the owners with advanced construction technology and products and services, and contribute more to the high-quality development of the semiconductor industry.